T.E.A.M. Services provides high quality mixed technology assembly services meeting IPC-A-610 Class II standards. Our Panasonic based surface mount assembly production line is set up to support quick turnaround, precision, and small to medium sized production runs. Stringent ESD controls are in place throughout our facility.

Surfacemount Assembly

SPPG1 Automatic Screen Printer
Uses visual recognition for precise (± 0.05mm) paste positioning and digital print head for consistency. Fully automatic pass through feeds directly to SMT chip shooter minimizing board handling.

Panasonic MV100 Chip Shooter
High speed SMT chip shooter places components as small as 0402 at a rate of up to 14,400 per hour. Visual recognition and verification of every component ensures precise placement.

Panasonic MPAG1
Multifunctional fine pitch SMT placement machine is able to place variety of components from 0603 chips, cylindrical and odd shaped devices to 50mm QFP and BGA packages. Camera with 3-tiered lighting array enables QFP co-planarity check and BGA verification.

Customer supplied component data is optimized offline and downloaded prior to production. Exact centroid and reference data is forwarded to each machine.

Novastar 1800 A
Reflow oven with 4 zones, each monitored by top and bottom digitally controlled forced convection.

Each assembly is profiled thermally prior to production; ensuring the reflow process adheres to both solder manufacturer and customer's specifications.

Econopak II
Dual wave ensures that IPC Class II standards will be met in the final stage of any through hole assembly.

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Pin Through Hole

Capabilities to place tape and reeled radial leaded LED sizes from T ¾ to T 1¾. Maximum PCB size of 24" x 24". Placement rates reach 2000 to 4000 pieces per hour with an accuracy of > 98% minimizing component loss.


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Flex Circuit Assembly

Conductive silver epoxies or carbon blend inks on polyester substrate. UV epoxy curing for complete circuit encapsulation against heat and vibration in harsh industrial environments

Circuit testing services available to guarantee complete functionality.

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Extended Services

Universal Automated PTH for quick turn volume through-hole production
runs. Axial, Radial, Dip Auto Insertion and 40 Station Sequencing.

AOI Testing
Golden Board or Centroid data input. Full color, high speed IEEE I394 fire wire interface. Data results are exportable for SPC purposes.

X-Ray Inspection
Analysis software used for measurement, calculation and validation of
X-Ray image.

In-Circuit Testing
ICT used in conjunction with AOI minimizes functional defects caused by component problems.

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Design

Our associated engineers have extensive design experience in the following fields:

  • Concept design consultation
  • Analog/digital design
  • MCU and firmware
  • Digital sound, MPEG3
  • RF communications
  • Schematics and PCB layout
  • Manufacturing recommendations

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Consignment Manufacturing

Most of our assembly contracts are comprised of consignment based supply. However, with our extensive component background and industry contacts we are able to provide full turnkey solutions from product concept to final assemblies.

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ISO9000 Certification

We have implemented an ISO9000 quality system to IPC-A-610 Class II standards, with full intention of applying for certification in the Year 2004. Full documentation and reporting procedures are in place to ensure that we achieve that goal.

We currently adhere to and report within ISO9001 standards set by our clients.

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  -Surfacemount Assembly
  -Pin Through Hole
  -Flexcircuit Assembly
  -Extended services
  -Design
  -Consignment Manufacturing
  -ISO 9000 Certification

 

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